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AFS600-FGG256K

AFS600-FGG256K

AFS600-FGG256K

Microsemi Corporation

FPGAs Fusion? Series 256-LBGA

SOT-23

AFS600-FGG256K Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 16 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature -55°C~100°C TJ
Packaging Tray
Published 2013
Series Fusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -55°C
Voltage - Supply 1.425V~1.575V
Base Part Number AFS600
Number of I/O 119
RAM Size 13.5kB
Total RAM Bits 110592
Number of Gates 600000
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
90 $336.07678 $30246.9102
AFS600-FGG256K Product Details

AFS600-FGG256K Overview


A 256-LBGA package contains it, and it is available for download. The I/Os are designed to facilitate a more coherent transfer of data. This FPGA module can be attached to the development board with a Surface Mount. With a supply voltage of 1.425V~1.575V, this device operates with ease. The Fusion? Series is one of the types of FPGAs that belong to this type. The operating temperature should be kept at -55°C~100°C TJ when operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. This device has 110592 RAM bits, which is the number of RAM bits that this device offers. Its base part number AFS600 can be used to find parts that are related to it. The RAM si13.5kBe of this FPGA module reaches 13.5kB to ensure normal operation of the program. It has a total of 256 pins that are designed for it. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. As a result of the design of this module, the maximum operating temperature reaches 100°C. Fpga electronics is recommended that the operating temperature be higher than -55°C. The basic building block of this system consists of 600000 gates. There is a device package provided by 256-FPBGA (17x17), which is the supplier.

AFS600-FGG256K Features


119 I/Os
Up to 110592 RAM bits
256 LABs/CLBs
100°C gates

AFS600-FGG256K Applications


There are a lot of Microsemi Corporation AFS600-FGG256K FPGAs applications.

  • Filtering and communication encoding
  • Medical Applications
  • Cryptography
  • Software-defined radio
  • Military Temperature
  • Industrial IoT
  • Random logic
  • Audio
  • Defense Applications
  • Security systems

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