There are two packages that contain fpga chips: 256-LBGA package and X package. There are 178 I/Os for better data transfer. In order to construct a fundamental building block, 9216 logic elements/cells are required. An FPGA module can be attached to a development board with a Surface Mount-pin. This device is powered by a 1.14V~1.575V battery. The IGLOO Series is one of the types of FPGAs that belong to this type. During the operation of the system, the operating temperature should remain within the range of 0°C~70°C TA. Using the Tray layout, this FPGA model can be contained in a very small amount of space. Fpga electronics is worth mentioning that this device provides 55296 bfpga electronics s of RAM. Parts related to this part can be found using its base part number AGL400. The RAM si6.8kBe of this FPGA module reaches 6.8kB so as to guarantee the normal operation of the program during operation. The device has 256 pins which are included in the design. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. Its flexibility can be fully utilized when operating with a 1.5V supply voltage. A maximum operating temperature of 70°C can be reached by this module. Over 0°C should be the operating temperature. The basic building block of this system consists of 400000 gates. The maximum supply voltage it supports is 1.575V. As long as the supply voltage is at least 1.14V, it is able to work properly. This FPGA can get as fast as 250MHz. There is a 27μA supply current used in its operation. The device package supplied by 256-FPBGA (17x17) is one of its suppliers.
AGL400V2-FG256 Features
178 I/Os Up to 55296 RAM bits 256 LABs/CLBs 70°C gates
AGL400V2-FG256 Applications
There are a lot of Microsemi Corporation AGL400V2-FG256 FPGAs applications.
Development Boards and Shields for Microcontrollers