There are two packages that contain fpga chips: 256-LBGA package and X package. The device has 177 I/O ports for more coherent data transfer. In order to construct a fundamental building block, 13824 logic elements/cells are required. Using a Surface Mount connector, you can mount this FPGA module on the development board. This device is powered by a 1.425V~1.575V battery. It is a type of FPGA belonging to the IGLOO seies. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~70°C TA while the machine is operating. This FPGA model is contained in Tray for space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 110592 bFpga chipss. AGL600 is the base part number that can be used to identify related parts. Fpga electronics is important that this FPGA module has a RAM si13.5kBe of 13.5kB in order to ensure that the program will run normally. The device is designed with 256 pins in total. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. The 1.5V supply voltage provides designers with full flexibility in their designs. The maximal operating temperature of this module reaches 70°C. Fpga electronics is recommended that the operating temperature be higher than 0°C. The building block that forms the basis of the system contains 600000 gates. Fpga semiconductor can accept a maximum voltage of 1.575V volts as a supply voltage. Using a supply voltage as low as 1.425V, fpga semiconductor will work. There is a possibility that this FPGA will be able to reach a speed of 892.86MHz. The device package supplied by 256-FPBGA (17x17) is one of its suppliers.
AGL600V5-FG256 Features
177 I/Os Up to 110592 RAM bits 256 LABs/CLBs 70°C gates
AGL600V5-FG256 Applications
There are a lot of Microsemi Corporation AGL600V5-FG256 FPGAs applications.