APA300-BGG456M Overview

In the 456-BBGA package, you will find fpga chips. This device features 290 I/Os in order to transfer data in a more efficient manner. FPGA modules can be attached to development boards using a Surface Mount-connector. With a supply voltage of 2.3V~2.7V, this device operates with ease. An FPGA belonging to the ProASICPLUS series is referred to as an FPGA. When operating the machine, it is important to keep the temperature within -55°C~125°C TC range. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The RAM bits that are offered by this fpga chips are 73728. You can find related parts by using the part number APA300, which is its base part number. For the program to work properly, the RAM si9kBe of this FPGA module must reach 9kB GB in order to ensure normal operation. The device has 456 pins which are included in the design. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. Designers can fully utilize its flexibility with 2.5V supply voltage. The maximal operating temperature of this module reaches 125°C. Fpga electronics is necessary to maintain an operating temperature higher than -55°C. 300000 gates make up the basic block of its construction. Fpga semiconductor is important to note that the data is stored and transferred in 8192 different registers. The high efficiency of this device is provided by its 180MHz-frequency operation. A maximum voltage of 2.7V can be supplied to it. Fpga semiconductor is able to work wfpga semiconductorh the minimal supply voltage of 2.3V. Using this FPGA, you can get speeds up to 180MHz. The device package supplied by 456-PBGA (35x35) is one of its suppliers.

APA300-BGG456M Features

290 I/Os
Up to 73728 RAM bits
456 LABs/CLBs
125°C gates
8192 registers
Operating from a frequency of 180MHz

APA300-BGG456M Applications

There are a lot of Microsemi Corporation APA300-BGG456M FPGAs applications.

• Broadcast
• Bioinformatics
• Wired Communications
• Electronic Warfare
• Security systems
• Artificial intelligence (AI)
• Industrial Ethernet
• Data center hardware accelerators
• Ecosystem
• Telecommunication