JAN1N6641US

new-10%

Manufacturer part number:JAN1N6641US

Manufacturer:Microsemi Corporation

Description:Diodes - General Purpose, Power, Switching Switching

Case Package:SOT-23

Datasheet:JAN1N6641US Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	8 Weeks
Contact Plating	Lead, Tin
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	SQ-MELF, B
Number of Pins	2
Diode Element Material	SILICON
Packaging	Bulk
Series	Military, MIL-PRF-19500/609
JESD-609 Code	e0
Pbfree Code	no
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	2
ECCN Code	EAR99
Terminal Finish	Tin/Lead (Sn/Pb)
Max Operating Temperature	175°C
Min Operating Temperature	-65°C
Additional Feature	METALLURGICALLY BONDED
HTS Code	8541.10.00.70
Terminal Position	END
Terminal Form	WRAP AROUND
Peak Reflow Temperature (Cel)	NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)	NOT SPECIFIED
Pin Count	2
Reference Standard	MIL-19500/609D
Qualification Status	Qualified
Number of Elements	1
Element Configuration	Single
Speed	Fast Recovery =< 500ns, > 200mA (Io)
Diode Type	Standard
Current - Reverse Leakage @ Vr	100nA @ 50V
Voltage - Forward (Vf) (Max) @ If	1.1V @ 300mA
Case Connection	ISOLATED
Forward Current	300mA
Operating Temperature - Junction	-65°C~175°C
Output Current-Max	0.3A
Reverse Recovery Time	5ns
Max Repetitive Reverse Voltage (Vrrm)	50V
RoHS Status	Non-RoHS Compliant