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M1A3P400-2FGG256

M1A3P400-2FGG256

M1A3P400-2FGG256

Microsemi Corporation

FPGAs ProASIC3 Series 256-LBGA

SOT-23

M1A3P400-2FGG256 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2003
Series ProASIC3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Voltage - Supply 1.425V~1.575V
Base Part Number M1A3P400
Number of I/O 178
RAM Size 6.8kB
Total RAM Bits 55296
Number of Gates 400000
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
90 $40.00000 $3600
M1A3P400-2FGG256 Product Details

M1A3P400-2FGG256 Overview


As part of the 256-LBGA package, it is included. Having 178 I/Os makes data transfers more coherent. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates wFpga chipsh a supply voltage of 1.425V~1.575V. As part of the ProASIC3 series of FPGAs, it is a type of FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. Having a RAM bit size of 55296 means that this device will offer you a lot of memory. In order to find related parts, you can use its base part number M1A3P400. For the program to work properly, the RAM si6.8kBe of this FPGA module must reach 6.8kB GB in order to ensure normal operation. Fpga electronics is designed wfpga electronics h 256 pins. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. In this module, 70°C is the maximum operating temperature at which fpga electronics can operate. Over 0°C, the operating temperature should be higher. The building block that forms the basis of the system contains 400000 gates. The device package supplied by 256-FPBGA (17x17) is one of its suppliers.

M1A3P400-2FGG256 Features


178 I/Os
Up to 55296 RAM bits
256 LABs/CLBs
70°C gates

M1A3P400-2FGG256 Applications


There are a lot of Microsemi Corporation M1A3P400-2FGG256 FPGAs applications.

  • Wireless Communications
  • Development Boards and Shields for Microcontrollers
  • Device controllers
  • Aircraft navigation
  • Audio
  • Random logic
  • Server Applications
  • Wired Communications
  • Automotive Applications
  • Artificial intelligence (AI)

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