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M1A3P400-FG256

M1A3P400-FG256

M1A3P400-FG256

Microsemi Corporation

FPGAs ProASIC3 Series 256-LBGA

SOT-23

M1A3P400-FG256 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series ProASIC3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Voltage - Supply 1.425V~1.575V
Base Part Number M1A3P400
Number of I/O 178
RAM Size 6.8kB
Total RAM Bits 55296
Number of Gates 400000
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
90 $33.76000 $3038.4
M1A3P400-FG256 Product Details

M1A3P400-FG256 Overview


A 256-LBGA package contains it, and it is available for download. Fpga chips is programmed wFpga chipsh 178 I/Os for transferring data in a more coherent manner. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 1.425V~1.575V is needed in order for fpga chips to operate. As part of the ProASIC3 series of FPGAs, it is a type of FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The RAM bits that are offered by this fpga chips are 55296. If you are looking for related parts, you can use the base part number M1A3P400 as a starting point. Fpga electronics is important that this FPGA module has a RAM si6.8kBe of 6.8kB in order to ensure that the program will run normally. The device has 256 pins which are included in the design. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. During its maximal operating temperature, this module reaches 70°C. 0°C should be higher than the operating temperature. Fpga semiconductor is made up of 400000 gates as fpga semiconductors basic building block. The supplier of the device package is 256-FPBGA (17x17).

M1A3P400-FG256 Features


178 I/Os
Up to 55296 RAM bits
256 LABs/CLBs
70°C gates

M1A3P400-FG256 Applications


There are a lot of Microsemi Corporation M1A3P400-FG256 FPGAs applications.

  • Automotive driver's assistance
  • Wired Communications
  • Medical Electronics
  • OpenCL
  • Integrating multiple SPLDs
  • Distributed Monetary Systems
  • Data Mining
  • Industrial IoT
  • Aircraft navigation
  • Artificial intelligence (AI)

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