There is a 144-LBGA package that includes this component. The device has 177 I/O ports for more coherent data transfer. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.14V~1.575V battery. As part of the ProASIC3L series of FPGAs, it is a type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 110592 bFpga chipss. M1A3P600L is the base part number that can be used to identify related parts. The FPGA module's RAM si13.5kBe reaches 13.5kB in order to ensure that the program operates in a normal manner. In this case, 144 pins are used in the design. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. With a 1.2V supply voltage, designers can fully utilize the flexibility of the device. A maximum operating temperature of 70°C can be reached by this module. A higher operating temperature than 0°C is recommended. The building block that forms the basis of the system contains 600000 gates. There are 13824 registers used to store and transfer data. The maximum supply voltage it can take is 1.26V. The unit is capable of working with a minimum supply voltage of 1.14V. As far as the speed of this FPGA is concerned, it can get up to 781.25MHz. Device package 144-FPBGA (13x13) is provided by its supplier.
M1A3P600L-FGG144 Features
177 I/Os Up to 110592 RAM bits 144 LABs/CLBs 70°C gates 13824 registers
M1A3P600L-FGG144 Applications
There are a lot of Microsemi Corporation M1A3P600L-FGG144 FPGAs applications.