This package is included in the 676-BGA package and is available for purchase. Its 252 I/Os help it transfer data more efficiently. Using a Surface Mount connector, you can mount this FPGA module on the development board. This device is powered by a 1.425V~1.575V battery. This is a type of FPGA that is part of the Fusion? series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. This device has 276480 RAM bits, which is the number of RAM bits that this device offers. Related parts can be found by using its base part number M1AFS1500. The RAM si33.8kBe of this FPGA module reaches 33.8kB so as to guarantee the normal operation of the program during operation. There are 676 pins on this device. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Design engineers can fully take advantage of its flexibility when operating at 1.5V supply voltage. A maximum operating temperature of 70°C can be reached by this module. In order to achieve 0°C, the operating temperature must be higher than 0°C. Fpga semiconductor is made up of 1500000 gates as fpga semiconductors basic building block. During the process of storing and transferring data, 38400 registers are used. To achieve high efficiency, it runs at a frequency of 1.0989GHz. Fpga semiconductor supports the maximal supply voltage of 1.575V. Using 1.425V as the minimum supply voltage, fpga semiconductor can operate. In fact, this FPGA is capable of reaching a speed of 1.0989GHz. The supplier of the device package is 676-FBGA (27x27).
M1AFS1500-FGG676 Features
252 I/Os Up to 276480 RAM bits 676 LABs/CLBs 70°C gates 38400 registers Operating from a frequency of 1.0989GHz
M1AFS1500-FGG676 Applications
There are a lot of Microsemi Corporation M1AFS1500-FGG676 FPGAs applications.