M1AFS600-1FG256K Overview

A 256-LBGA package is provided with this component. This device features 119 I/Os in order to transfer data in a more efficient manner. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 1.425V~1.575V . As part of the Fusion? series of FPGAs, it is a type of FPGA. Operating temperatures should be maintained within the -55°C~100°C TJ range at all times when the unit is in use. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The RAM bits that are offered by this fpga chips are 110592. If you are looking for related parts, you can use the base part number M1AFS600 as a starting point. During the configuration of this FPGA module, the RAM si13.5kBe reaches 13.5kB to ensure that the program runs normally. The device has 256 pins which are included in the design. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. In this module, 100°C is the maximum operating temperature at which fpga electronics can operate. A higher operating temperature than -55°C is recommended. Fpga semiconductor is made up of 600000 gates as fpga semiconductors basic building block. There is a device package provided by 256-FPBGA (17x17) as its supplier.

M1AFS600-1FG256K Features

119 I/Os
Up to 110592 RAM bits
256 LABs/CLBs
100°C gates

M1AFS600-1FG256K Applications

There are a lot of Microsemi Corporation M1AFS600-1FG256K FPGAs applications.

• Data Center
• Industrial IoT
• Digital signal processing
• Device controllers
• Automotive driver's assistance
• Data center hardware accelerators
• Camera time adjustments
• Scientific Instruments
• Automotive
• Industrial Ethernet