A 484-BGA package contains it, and it is available for download. There are 172 I/Os for better data transfer. Surface Mount-connectors can be used to attach this FPGA module to the development board. This device is powered by a 1.425V~1.575V battery. The Fusion? series FPGA is a type of FPGA that belongs to the Fusion? family of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The RAM bits that this device offer is 110592. For related parts, use its base part number M1AFS600. During the configuration of this FPGA module, the RAM si13.5kBe reaches 13.5kB to ensure that the program runs normally. Fpga electronics is designed wfpga electronics h 484 pins. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Designers can fully utilize its flexibility with 1.5V supply voltage. A maximum operating temperature of 70°C can be reached by this module. Operating temperatures should exceed 0°C. As a basic building block, fpga semiconductor consists of 600000 gates. The data is stored and transferred using 13824 registers that are used for this purpose. Fpga semiconductor can accept a maximum voltage of 1.575V volts as a supply voltage. The device can function at a minimum voltage of 1.425V. As fast as 1.28205GHz can be reached with this FPGA. 484-FPBGA (23x23) stands for its supplier device package.
M1AFS600-1FGG484 Features
172 I/Os Up to 110592 RAM bits 484 LABs/CLBs 70°C gates 13824 registers
M1AFS600-1FGG484 Applications
There are a lot of Microsemi Corporation M1AFS600-1FGG484 FPGAs applications.