M1AFS600-1PQG208 Overview

There are two packages that contain fpga chips: 208-BFQFP package and X package. 95 I/Os are available for transferring data more efficiently. Using a Surface Mount connector, you can mount this FPGA module on the development board. The supply voltage of the device is 1.425V~1.575V , at which it runs. FPGAs belonging to the Fusion? series are a type of FPGA that belong to the Fusion? series of FPGAs. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. There is an FPGA model contained in Tray in order to conserve space. A device like this one offers 110592 RAM bits, which is a considerable amount of memory. Related parts can be found by using its base part number M1AFS600. Fpga semiconductor is made up of 600000 gates as fpga semiconductors basic building block. As a supplier, 208-PQFP (28x28) is responsible for the package of its devices.

M1AFS600-1PQG208 Features

95 I/Os
Up to 110592 RAM bits

M1AFS600-1PQG208 Applications

There are a lot of Microsemi Corporation M1AFS600-1PQG208 FPGAs applications.

• Server Applications
• Device controllers
• Development Boards and Shields for Microcontrollers
• Wireless Communications
• Software-defined radio
• Solar Energy
• Artificial intelligence (AI)
• Audio
• Image processing
• Automation