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M1AFS600-FG256K

M1AFS600-FG256K

M1AFS600-FG256K

Microsemi Corporation

FPGAs Fusion? Series 256-LBGA

SOT-23

M1AFS600-FG256K Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature -55°C~100°C TJ
Packaging Tray
Published 2013
Series Fusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -55°C
Voltage - Supply 1.425V~1.575V
Base Part Number M1AFS600
Number of I/O 119
RAM Size 13.5kB
Total RAM Bits 110592
Number of Gates 600000
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
90 $336.07678 $30246.9102
M1AFS600-FG256K Product Details

M1AFS600-FG256K Overview


A 256-LBGA package contains it, and it is available for download. Having 119 I/Os makes data transfers more coherent. FPGA modules can be attached to development boards using a Surface Mount-connector. Powered by a 1.425V~1.575V supply voltage, fpga chips is able to operate at high speeds. It is a type of FPGA that belongs to the Fusion? series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -55°C~100°C TJ when operating the machine. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. There are 110592 RAM bits that are available with this device. Parts related to this part can be found using its base part number M1AFS600. Fpga electronics is important that this FPGA module has a RAM si13.5kBe of 13.5kB in order to ensure that the program will run normally. It has a total of 256 pins that are designed for it. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In this module, 100°C is the maximum operating temperature at which fpga electronics can operate. -55°C should be higher than the operating temperature. The basic building block of this system consists of 600000 gates. The device package supplied by 256-FPBGA (17x17) is one of its suppliers.

M1AFS600-FG256K Features


119 I/Os
Up to 110592 RAM bits
256 LABs/CLBs
100°C gates

M1AFS600-FG256K Applications


There are a lot of Microsemi Corporation M1AFS600-FG256K FPGAs applications.

  • Software-defined radios
  • Solar Energy
  • Data center hardware accelerators
  • Random logic
  • Space Applications
  • Artificial intelligence (AI)
  • Software-defined radio
  • Digital signal processing
  • Industrial,Medical and Scientific Instruments
  • Secure Communication

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