M2GL060-1FG676 Overview

There are two packages that contain fpga chips: 676-BGA package and X package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. 387 I/Os are available for transferring data more efficiently. A fundamental building block is made up of 56520 logic elements/cells. It is powered from a supply voltage of 1.2V. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Powered by a 1.14V~2.625V supply voltage, fpga chips is able to operate at high speeds. There are many types of FPGAs in the IGLOO2 series, this is one of them. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, the terminations of this piece are 676. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1869824 bFpga chipss.

M2GL060-1FG676 Features

387 I/Os
Up to 1869824 RAM bits

M2GL060-1FG676 Applications

There are a lot of Microsemi Corporation M2GL060-1FG676 FPGAs applications.

• Aerospace and Defense
• Device controllers
• Video & Image Processing
• Voice recognition
• Server Applications
• OpenCL
• Solar Energy
• Distributed Monetary Systems
• Integrating multiple SPLDs
• Data center search engines