0°C~85°C TJ System On Chip SmartFusion®2 Series 209 I/O
SOT-23
M2S005S-1FGG484 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Lifecycle Status
IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time
12 Weeks
Package / Case
484-BGA
Supplier Device Package
484-FPBGA (23x23)
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Series
SmartFusion®2
Published
2010
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of I/O
209
Speed
166MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Primary Attributes
FPGA - 5K Logic Modules
Flash Size
128KB
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
60
$27.08100
$1624.86
M2S005S-1FGG484 Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 484-BGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion®2 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.Taking note of the fact that this SoC security combines FPGA - 5K Logic Modules is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 209 I/Os.A flashing 128KB appears on it.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 128KB extended flash.
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M2S005S-1FGG484 System On Chip (SoC) applications.