0°C~85°C TJ System On Chip SmartFusion®2 Series 233 I/O
SOT-23
M2S010TS-1FGG484 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Package / Case
484-BGA
Supplier Device Package
484-FPBGA (23x23)
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Series
SmartFusion®2
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of I/O
233
Speed
166MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR, PCIe, SERDES
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Primary Attributes
FPGA - 10K Logic Modules
Flash Size
256KB
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
60
$54.36000
$3261.6
M2S010TS-1FGG484 Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor ARM® Cortex®-M3 is embedded in this SoC.It has been assigned a package 484-BGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion®2 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.This SoC security combines FPGA - 10K Logic Modules and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 233 I/Os in total.This flash has a size of 256KB.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 256KB extended flash.
There are a lot of Microsemi Corporation
M2S010TS-1FGG484 System On Chip (SoC) applications.