325 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 180 I/O 1.2V
SOT-23
M2S025T-FCS325I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Package / Case
325-TFBGA, CSPBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
SmartFusion®2
Published
2015
JESD-609 Code
e0
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
325
Terminal Finish
Tin/Lead (Sn/Pb)
Additional Feature
LG-MIN, WD-MIN
HTS Code
8542.39.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1.2V
Terminal Pitch
0.5mm
Reach Compliance Code
not_compliant
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B325
Number of Outputs
180
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
1.26V
Power Supplies
1.2V
Supply Voltage-Min (Vsup)
1.14V
Number of I/O
180
Speed
166MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR, PCIe, SERDES
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Number of Inputs
180
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes
FPGA - 25K Logic Modules
Number of Logic Cells
27696
Flash Size
256KB
Length
11mm
Height Seated (Max)
1.01mm
Width
11mm
RoHS Status
Non-RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
176
$59.24801
$10427.64976
M2S025T-FCS325I Product Details
This SoC is built on ARM® Cortex®-M3 core processor(s).
ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 325-TFBGA, CSPBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion®2 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines FPGA - 25K Logic Modules is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 180 I/Os.Use a power supply with a voltage of 1.2V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.26V.Power supplies of at least 1.14V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A system on a chip benefits from having 325 terminations.A SoC chip like this can have 180 outputs.In order to operate system on chip, you will need 1.2V power supplies.This SoC chip has a total of 180 inputs that can be used.The logic SoC features 27696 logic cells.A flashing 256KB appears on it.This SoC processor also includes LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM. Built on MCU, FPGA. 256KB extended flash. LG-MIN, WD-MIN
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M2S025T-FCS325I System On Chip (SoC) applications.