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M2S050-1FG896

M2S050-1FG896

M2S050-1FG896

Microsemi Corporation

0°C~85°C TJ M2S050 System On Chip SmartFusion®2 Series 377 I/O

SOT-23

M2S050-1FG896 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time 10 Weeks
Package / Case 896-BGA
Supplier Device Package 896-FBGA (31x31)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®2
Published 2009
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 166MHz
Base Part Number M2S050
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 377
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes FPGA - 50K Logic Modules
Flash Size 256KB
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
27 $126.38037 $3412.26999
M2S050-1FG896 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 896-BGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 50K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 377 inputs and outputs.This flash has a size of 256KB.It is possible to find system on chips that are similar in specs and purpose by searching for M2S050.During operation, the wireless SoC runs at a frequency of 166MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.In order for the SoC computing to start, 0°C is just about right.There is a maximum operating temperature of 85°C set for this SoC system on chip during its design.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


M2S050-1FG896 System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control

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