This SoC is built on ARM® Cortex®-M3 core processor(s).

There are ARM® Cortex®-M3 core processors in this SoC.This system on a chip is packaged as 896-BGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion®2 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 50K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 377 I/Os.The flash is set to 256KB.By searching M2S050, you can find system on chips with similar specs and purposes.There is 166MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.It is just enough to start the SoC computing at -40°C.As designed, this SoC system on chip can operate at a maximum temperature of 100°C.

ARM® Cortex®-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S050-1FG896I System On Chip (SoC) applications.

• Industrial transport
• Industrial robot
• High-end PLC
• Vending machines
• POS Terminals
• Measurement tools
• Measurement testers
• Networked sensors
• Robotics
• Central alarm system