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M2S060-1FGG676

M2S060-1FGG676

M2S060-1FGG676

Microsemi Corporation

676 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 387 I/O 1.2V

SOT-23

M2S060-1FGG676 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Factory Lead Time 10 Weeks
Package / Case 676-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®2
Published 2015
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Number of Outputs 387
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 387
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 387
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Length 27mm
Height Seated (Max) 2.44mm
Width 27mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
40 $114.89875 $4595.95
M2S060-1FGG676 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


On this SoC, there is ARM® Cortex®-M3 core processor.Assigned with the package 676-BGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion®2 series.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 60K Logic Modules.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 387 I/Os.It is recommended to use a 1.2V power supply.In the SoCs wireless, voltages above 1.26V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.In total, there are 676 terminations, which is great for system on a chip.There are 387 outputs available on this SoC.A power supply of 1.2V is required to run system on chip.On the SoC chip, there are 387 inputs available for use.Logic system on chips consist of 56520 logic cells.There is a flash of 256KB on it.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.


There are a lot of Microsemi Corporation


M2S060-1FGG676 System On Chip (SoC) applications.


  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices

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