Welcome to Hotenda.com Online Store!

logo
userjoin
Home

M2S060T-FCSG325

M2S060T-FCSG325

M2S060T-FCSG325

Microsemi Corporation

325 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V

SOT-23

M2S060T-FCSG325 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time 10 Weeks
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®2
Published 2015
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 200
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 200
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 200
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Length 11mm
Height Seated (Max) 1.01mm
Width 11mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
176 $78.57000 $13828.32
M2S060T-FCSG325 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


On this SoC, there is ARM® Cortex®-M3 core processor.Assigned with the package 325-TFBGA, CSPBGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion®2 series.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 60K Logic Modules.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 200 I/Os.It is recommended to use a 1.2V power supply.In the SoCs wireless, voltages above 1.26V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.In total, there are 325 terminations, which is great for system on a chip.There are 200 outputs available on this SoC.A power supply of 1.2V is required to run system on chip.On the SoC chip, there are 200 inputs available for use.Logic system on chips consist of 56520 logic cells.There is a flash of 256KB on it.Further features of this SoC processor are LG-MIN, WD-MIN.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN


There are a lot of Microsemi Corporation


M2S060T-FCSG325 System On Chip (SoC) applications.


  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices

Related Part Number

Get Subscriber

Enter Your Email Address, Get the Latest News