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M2S060T-FGG484

M2S060T-FGG484

M2S060T-FGG484

Microsemi Corporation

484 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 267 I/O 1.2V

SOT-23

M2S060T-FGG484 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time 10 Weeks
Package / Case 484-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®2
Published 2015
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 267
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 267
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 267
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Length 23mm
Height Seated (Max) 2.44mm
Width 23mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
60 $105.00417 $6300.2502
M2S060T-FGG484 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 484-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.It is important to note that this SoC security combines FPGA - 60K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.267 I/Os are included in this SoC part.A 1.2V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.At least 1.14V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 484 terminations, which makes system on a chip possible.A SoC chip with 267 outputs is available.A power supply of 1.2V is required.A SoC chip with 267 inputs is available.A logic SoC has 56520 logic cells.A 256KB flash can be seen on it.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.


There are a lot of Microsemi Corporation


M2S060T-FGG484 System On Chip (SoC) applications.


  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics

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