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M2S060TS-1FCSG325I

M2S060TS-1FCSG325I

M2S060TS-1FCSG325I

Microsemi Corporation

325 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V

SOT-23

M2S060TS-1FCSG325I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time 10 Weeks
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
Published 2015
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 200
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 200
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 200
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Length 11mm
Height Seated (Max) 1.01mm
Width 11mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
176 $106.42659 $18731.07984
M2S060TS-1FCSG325I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


A core processor ARM® Cortex®-M3 is embedded in this SoC.It has been assigned a package 325-TFBGA, CSPBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion®2 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines FPGA - 60K Logic Modules and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 200 I/Os in total.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.As a result, there are 325 terminations in total, which does really benefit system on a chip.The SoC chip that comes with this module can be configured to have 200 outputs.In order to use system on chip, you will need a power supply of 1.2V.This SoC chip is equipped with 200 inputs for the user to choose from.The logic system on chips contain 56520 logic cells.This flash has a size of 256KB.Moreover, this SoC processor is also equipped with additional features of LG-MIN, WD-MIN.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN


There are a lot of Microsemi Corporation


M2S060TS-1FCSG325I System On Chip (SoC) applications.


  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare

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