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M2S090-1FGG484

M2S090-1FGG484

M2S090-1FGG484

Microsemi Corporation

484 Terminations 0°C~85°C TJ 484 Pin M2S090 System On Chip SmartFusion®2 Series 267 I/O 1.2V Min 1.14V V Max 1.26V V

SOT-23

M2S090-1FGG484 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time 8 Weeks
Mount Surface Mount
Package / Case 484-BGA
Number of Pins 484
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®2
Published 2009
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S090
Number of Outputs 267
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Max Supply Voltage 1.26V
Min Supply Voltage 1.14V
Number of I/O 267
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Length 23mm
Height Seated (Max) 2.44mm
Width 23mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
60 $178.47267 $10708.3602
M2S090-1FGG484 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 484-BGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 90K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 267 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 484 terminations.This SoC chip is capable of having 267 outputs, which is convenient.System on chips of logic are comprised of 86316 logic cells.This flash has a size of 512KB.It is possible to find system on chips that are similar in specs and purpose by searching for M2S090.During operation, the wireless SoC runs at a frequency of 166MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 484.Voltages up to 1.26V are specified for this SoC security.Power is provided to it at least to the extent that 1.14V is required.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


M2S090-1FGG484 System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control

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