This SoC is built on ARM® Cortex®-M3 core processor(s).

Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 676-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.It is important to note that this SoC security combines FPGA - 90K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.425 I/Os are included in this SoC part.A 1.2V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.At least 1.14V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 676 terminations, which makes system on a chip possible.A SoC chip with 425 outputs is available.A power supply of 1.2V is required.A SoC chip with 425 inputs is available.A logic SoC has 86316 logic cells.A 512KB flash can be seen on it.Search M2S090 for system on chips with similar specs and purposes.wireless SoCs operate at 166MHz.Core architecture of ARM underpins the SoC meaning.

ARM® Cortex®-M3 processor.

64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S090-FGG676 System On Chip (SoC) applications.

• Body control module
• Industrial transport
• Industrial robot
• High-end PLC
• Vending machines
• POS Terminals
• Measurement tools
• Measurement testers
• Networked sensors
• Robotics