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M2S090TS-1FCSG325I

M2S090TS-1FCSG325I

M2S090TS-1FCSG325I

Microsemi Corporation

325 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 180 I/O 1.2V

SOT-23

M2S090TS-1FCSG325I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time 10 Weeks
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
Published 2015
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B325
Number of Outputs 180
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 180
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 180
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Length 13.5mm
Height Seated (Max) 1.16mm
Width 11mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
176 $161.23898 $28378.06048
M2S090TS-1FCSG325I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


A core processor(s) ARM® Cortex®-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 325-TFBGA, CSPBGA.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion®2 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines FPGA - 90K Logic Modules, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.180 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.If it has at least a 1.14V volt power supply, it can work fine.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.In total, there are 325 terminations, so system on a chip is really aided by this.There is the option to have 180 outputs on this SoC chip.As far as power supplies are concerned, system on chip requires 1.2V.Inputs are available on the SoC chip in the number of 180.There are 86316 logic cells in the logic system on chips.The flash size of the SoC meaning is 512KB.Moreover, this SoC processor also includes LG-MIN, WD-MIN as its additional features.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN


There are a lot of Microsemi Corporation


M2S090TS-1FCSG325I System On Chip (SoC) applications.


  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness

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