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M2S090TS-1FGG484I

M2S090TS-1FGG484I

M2S090TS-1FGG484I

Microsemi Corporation

484 Terminations -40°C~100°C TJ M2S090TS System On Chip SmartFusion®2 Series 267 I/O 1.2V

SOT-23

M2S090TS-1FGG484I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time 8 Weeks
Package / Case 484-BGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S090TS
JESD-30 Code S-PBGA-B484
Number of Outputs 267
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 267
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 267
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Length 23mm
Height Seated (Max) 2.44mm
Width 23mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
60 $235.58283 $14134.9698
M2S090TS-1FGG484I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 484-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 90K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.267 I/Os are included in this SoC part.A 1.2V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.At least 1.14V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 484 terminations, which makes system on a chip possible.A SoC chip with 267 outputs is available.A power supply of 1.2V is required.A SoC chip with 267 inputs is available.A logic SoC has 86316 logic cells.A 512KB flash can be seen on it.Search M2S090TS for system on chips with similar specs and purposes.wireless SoCs operate at 166MHz.Core architecture of ARM underpins the SoC meaning.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


M2S090TS-1FGG484I System On Chip (SoC) applications.


  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics

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