This SoC is built on ARM® Cortex®-M3 core processor(s).

ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 1152-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion®2 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.Taking note of the fact that this SoC security combines FPGA - 150K Logic Modules is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 574 I/Os.Use a power supply with a voltage of 1.2V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.26V.Power supplies of at least 1.14V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A SoC chip like this can have 574 outputs.In order to operate system on chip, you will need 1.2V power supplies.This SoC chip has a total of 574 inputs that can be used.The logic SoC features 146124 logic cells.A flashing 512KB appears on it.Searching M2S150 will bring up system on chips with similar specs and purposes.At 166MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.

ARM® Cortex®-M3 processor.

64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S150-1FCG1152 System On Chip (SoC) applications.

• Industrial robot
• High-end PLC
• Vending machines
• POS Terminals
• Measurement tools
• Measurement testers
• Networked sensors
• Robotics
• Central alarm system
• Smart appliances