This SoC is built on ARM® Cortex®-M3 core processor(s).

Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 1152-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 150K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.574 I/Os are included in this SoC part.A 512KB flash can be seen on it.Search M2S150S for system on chips with similar specs and purposes.wireless SoCs operate at 166MHz.Core architecture of ARM underpins the SoC meaning.For the SoC computing to start, -40°C is sufficient.This SoC system on chip operates at a maximum design temperature of 100°C.

ARM® Cortex®-M3 processor.

64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S150S-1FCG1152I System On Chip (SoC) applications.

• Body control module
• Industrial transport
• Industrial robot
• High-end PLC
• Vending machines
• POS Terminals
• Measurement tools
• Measurement testers
• Networked sensors
• Robotics