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MPF100T-FCSG325I

MPF100T-FCSG325I

MPF100T-FCSG325I

Microsemi Corporation

FPGAs PolarFire? Series 324-LFBGA

SOT-23

MPF100T-FCSG325I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case 324-LFBGA
Supplier Device Package 325-FPGA (11x11)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series PolarFire™
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.97V~1.08V
Number of I/O 170
Number of Logic Elements/Cells 109000
Total RAM Bits 7782400
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $232.15000 $232.15
10 $220.93800 $2209.38
MPF100T-FCSG325I Product Details

MPF100T-FCSG325I Overview


There is a 324-LFBGA package that includes this component. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block consists of 109000 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. This device is powered by a 0.97V~1.08V battery. It is a type of FPGA that belongs to the PolarFire? series of FPGAs. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. There are 7782400 RAM bits that are available with this device. Device package 325-FPGA (11x11) is provided by its supplier.

MPF100T-FCSG325I Features


170 I/Os
Up to 7782400 RAM bits

MPF100T-FCSG325I Applications


There are a lot of Microsemi Corporation MPF100T-FCSG325I FPGAs applications.

  • Data center hardware accelerators
  • Broadcast
  • Automotive driver's assistance
  • Enterprise networking
  • Voice recognition
  • Development Boards and Shields for Microcontrollers
  • ADAS
  • Camera time adjustments
  • Distributed Monetary Systems
  • Automotive advanced driver assistance systems (ADAS)

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