MPF100TS-1FCSG325I Overview

In the 324-LFBGA package, you will find fpga chips. There are 170 I/Os for better data transfer. A fundamental building block consists of 109000 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. With a supply voltage of 0.97V~1.08V, this device operates with ease. The PolarFire? Series is one of the types of FPGAs that belong to this type. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. As a space-saving measure, this FPGA model is contained within Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 7782400 bFpga chipss. This device package is supplied by 325-FPGA (11x11).

MPF100TS-1FCSG325I Features

170 I/Os
Up to 7782400 RAM bits

MPF100TS-1FCSG325I Applications

There are a lot of Microsemi Corporation MPF100TS-1FCSG325I FPGAs applications.

• High Performance Computing
• Consumer Electronics
• ADAS
• Bioinformatics
• Software-defined radios
• Scientific Instruments
• Wired Communications
• Wireless Communications
• Electronic Warfare
• Aircraft navigation