MPF200T-1FCG784E Overview

There are two packages that contain fpga chips: 784-BBGA, FCBGA package and X package. A total of 364 I/Os are programmed to ensure a more coherent data transfer. Logic elements/cells form the fundamental building block of a computer. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 0.97V~1.08V is needed in order for fpga chips to operate. FPGAs belonging to the PolarFire? series are a type of FPGA that belong to the PolarFire? series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. It is for space saving reasons that this FPGA model is contained in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 13619200 bFpga chipss. The device package supplied by 784-FCBGA (29x29) is one of its suppliers.

MPF200T-1FCG784E Features

364 I/Os
Up to 13619200 RAM bits

MPF200T-1FCG784E Applications

There are a lot of Microsemi Corporation MPF200T-1FCG784E FPGAs applications.

• Automotive Applications
• Wireless Communications
• Automation
• Industrial Ethernet
• Aerospace and Defense
• High Performance Computing
• Telecommunication
• Space Applications
• Data center hardware accelerators
• Automotive driver's assistance