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MPF200T-FCSG325I

MPF200T-FCSG325I

MPF200T-FCSG325I

Microsemi Corporation

FPGAs PolarFire? Series 324-LFBGA

SOT-23

MPF200T-FCSG325I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case 324-LFBGA
Supplier Device Package 325-FPGA (11x11)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series PolarFire™
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.97V~1.08V
Number of I/O 170
Number of Logic Elements/Cells 192000
Total RAM Bits 13619200
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $350.89000 $350.89
10 $333.94600 $3339.46
MPF200T-FCSG325I Product Details

MPF200T-FCSG325I Overview


In the 324-LFBGA package, you will find fpga chips. Having 170 I/Os makes data transfers more coherent. In order to construct a fundamental building block, 192000 logic elements/cells are required. Using a Surface Mount connector, you can mount this FPGA module on the development board. A supply voltage of 0.97V~1.08V is needed in order for fpga chips to operate. It is a type of FPGA belonging to the PolarFire? seies. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. In order to save space, this FPGA model has been contained in Tray. Having a RAM bit size of 13619200 means that this device will offer you a lot of memory. Device package 325-FPGA (11x11) is provided by its supplier.

MPF200T-FCSG325I Features


170 I/Os
Up to 13619200 RAM bits

MPF200T-FCSG325I Applications


There are a lot of Microsemi Corporation MPF200T-FCSG325I FPGAs applications.

  • Scientific Instruments
  • Ecosystem
  • Radar and Sensors
  • Medical Applications
  • Broadcast
  • Automotive Applications
  • Software-defined radio
  • Automotive advanced driver assistance systems (ADAS)
  • Secure Communication
  • ADAS

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