MPF200TL-FCG784E Overview

There are two packages that contain fpga chips: 784-BBGA, FCBGA package and X package. A total of 364 I/Os are programmed to ensure a more coherent data transfer. Logic elements/cells form the fundamental building block of a computer. Using a Surface Mount connector, you can mount this FPGA module on the development board. Powered by a 0.97V~1.08V supply voltage, fpga chips is able to operate at high speeds. It is a type of FPGA belonging to the PolarFire? seies. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. In order to save space, this FPGA model has been contained in Tray. This device is equipped with 13619200 RAM bits in terms of its RAM si13619200e. Its supplier package is called 784-FCBGA (29x29).

MPF200TL-FCG784E Features

364 I/Os
Up to 13619200 RAM bits

MPF200TL-FCG784E Applications

There are a lot of Microsemi Corporation MPF200TL-FCG784E FPGAs applications.

• Automotive advanced driver assistance systems (ADAS)
• Distributed Monetary Systems
• OpenCL
• Medical Electronics
• Filtering and communication encoding
• Artificial intelligence (AI)
• Data Mining
• Industrial,Medical and Scientific Instruments
• Defense Applications
• Device controllers