MPF200TL-FCG784I Overview

There are two packages that contain fpga chips: 784-BBGA, FCBGA package and X package. There are 364 I/Os for better data transfer. In order to construct a fundamental building block, 192000 logic elements/cells are required. The Surface Mount-slot on the development board allows you to attach the FPGA module. Powered by a 0.97V~1.08V supply voltage, fpga chips is able to operate at high speeds. An FPGA belonging to the PolarFire? series is referred to as an FPGA. The operating temperature should be kept at -40°C~100°C TJ when operating. A model of this FPGA is contained in Tray for the purpose of saving space. The RAM bits that are offered by this fpga chips are 13619200. 784-FCBGA (29x29) stands for its supplier device package.

MPF200TL-FCG784I Features

364 I/Os
Up to 13619200 RAM bits

MPF200TL-FCG784I Applications

There are a lot of Microsemi Corporation MPF200TL-FCG784I FPGAs applications.

• Bioinformatics
• Aerospace and Defense
• Integrating multiple SPLDs
• Defense Applications
• Ecosystem
• Solar Energy
• Computer hardware emulation
• Artificial intelligence (AI)
• Distributed Monetary Systems
• Device controllers