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MPF200TL-FCSG325I

MPF200TL-FCSG325I

MPF200TL-FCSG325I

Microsemi Corporation

FPGAs PolarFire? Series 324-LFBGA

SOT-23

MPF200TL-FCSG325I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case 324-LFBGA
Supplier Device Package 325-FPGA (11x11)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series PolarFire™
Part Status Active
Voltage - Supply 0.97V~1.08V
Number of I/O 170
Number of Logic Elements/Cells 192000
Total RAM Bits 13619200
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $381.13000 $381.13
MPF200TL-FCSG325I Product Details

MPF200TL-FCSG325I Overview


There is a 324-LFBGA package that includes this component. Fpga chips is programmed wFpga chipsh 170 I/Os for transferring data in a more coherent manner. The basic building blocks of logic contain 192000 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. This device is powered by a 0.97V~1.08V battery. This is a type of FPGA that is part of the PolarFire? series of FPGAs. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. The RAM bits that this device offer is 13619200. Its supplier package is called 325-FPGA (11x11).

MPF200TL-FCSG325I Features


170 I/Os
Up to 13619200 RAM bits

MPF200TL-FCSG325I Applications


There are a lot of Microsemi Corporation MPF200TL-FCSG325I FPGAs applications.

  • Server Applications
  • Telecommunication
  • Ecosystem
  • Data center search engines
  • Software-defined radios
  • Digital signal processing
  • Broadcast
  • Scientific Instruments
  • Cryptography
  • Data Center

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