MPF300T-1FCG484E Overview

Fpga chips is supplied in the 484-BBGA, FCBGA package. Fpga chips is programmed wFpga chipsh 244 I/Os for transferring data in a more coherent manner. In order to construct a fundamental building block, 300000 logic elements/cells are required. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Powered by a 0.97V~1.08V supply voltage, fpga chips is able to operate at high speeds. The PolarFire? Series is one of the types of FPGAs that belong to this type. The operating temperature should be kept at 0°C~100°C TJ when operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. A device like this one offers 21094400 RAM bits, which is a considerable amount of memory. There is a device package provided by 484-FCBGA (23x23), which is the supplier.

MPF300T-1FCG484E Features

244 I/Os
Up to 21094400 RAM bits

MPF300T-1FCG484E Applications

There are a lot of Microsemi Corporation MPF300T-1FCG484E FPGAs applications.

• Industrial IoT
• Aerospace and Defense
• Integrating multiple SPLDs
• ASIC prototyping
• Embedded Vision
• Audio
• Wired Communications
• Solar Energy
• Data Center
• Voice recognition