MPF300TL-FCG1152I Overview

In the 1152-BBGA, FCBGA package, you will find fpga chips. Fpga chips is programmed wFpga chipsh 512 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 300000 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. This device is powered by a 0.97V~1.08V battery. This is a type of FPGA that is part of the PolarFire? series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. This FPGA model is contained in Tray for space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 21094400 bFpga chipss. It employs 1152-FCBGA (35x35) as its supplier device package.

MPF300TL-FCG1152I Features

512 I/Os
Up to 21094400 RAM bits

MPF300TL-FCG1152I Applications

There are a lot of Microsemi Corporation MPF300TL-FCG1152I FPGAs applications.

• Wired Communications
• Automotive driver's assistance
• DO-254
• Automation
• Software-defined radios
• Electronic Warfare
• Telecommunication
• Military Temperature
• High Performance Computing
• Embedded Vision