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MPF300XT-1FCG1152E

MPF300XT-1FCG1152E

MPF300XT-1FCG1152E

Microsemi Corporation

FPGAs PolarFire? Series 1152-BBGA, FCBGA

SOT-23

MPF300XT-1FCG1152E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)
Operating Temperature0°C~100°C TJ
PackagingTray
Series PolarFire™
Part StatusActive
Voltage - Supply 0.97V~1.08V
Number of I/O 512
Number of Logic Elements/Cells 300000
Total RAM Bits 21094400
In-Stock:3444 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$471.74000$471.74

MPF300XT-1FCG1152E Product Details

MPF300XT-1FCG1152E Overview


Fpga chips is supplied in the 1152-BBGA, FCBGA package. Fpga chips is programmed wFpga chipsh 512 I/Os for transferring data in a more coherent manner. A fundamental building block contains 300000 logic elements or cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. With a supply voltage of 0.97V~1.08V, this device operates with ease. FPGAs belonging to the PolarFire? series are a type of FPGA that belong to the PolarFire? series of FPGAs. Operating temperatures should be maintained within the 0°C~100°C TJ range at all times when the unit is in use. In order to save space, this FPGA model has been contained in Tray. There are 21094400 RAM bits that are available with this device. 1152-FCBGA (35x35) stands for its supplier device package.

MPF300XT-1FCG1152E Features


512 I/Os
Up to 21094400 RAM bits

MPF300XT-1FCG1152E Applications


There are a lot of Microsemi Corporation MPF300XT-1FCG1152E FPGAs applications.

  • Industrial IoT
  • Computer hardware emulation
  • Broadcast
  • Wireless Communications
  • Medical Applications
  • Solar Energy
  • OpenCL
  • Development Boards and Shields for Microcontrollers
  • Medical imaging
  • Secure Communication

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