MPF300XT-1FCG784I Overview

There are two packages that contain fpga chips: 784-BBGA, FCBGA package and X package. Its 388 I/Os help it transfer data more efficiently. Logic blocks consist of 300000 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. Powered by a 0.97V~1.08V supply voltage, fpga chips is able to operate at high speeds. An FPGA belonging to the PolarFire? series is referred to as an FPGA. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. There is an FPGA model contained in Tray in order to conserve space. A device like this one offers 21094400 RAM bits, which is a considerable amount of memory. This device package is supplied by 784-FCBGA (29x29).

MPF300XT-1FCG784I Features

388 I/Os
Up to 21094400 RAM bits

MPF300XT-1FCG784I Applications

There are a lot of Microsemi Corporation MPF300XT-1FCG784I FPGAs applications.

• Medical Electronics
• Software-defined radio
• Aerospace and Defense
• Integrating multiple SPLDs
• Digital signal processing
• Industrial Ethernet
• Space Applications
• Image processing
• Ecosystem
• Industrial IoT