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U1AFS600-FG256

U1AFS600-FG256

U1AFS600-FG256

Microsemi Corporation

FPGAs Fusion? Series 256-LBGA

SOT-23

U1AFS600-FG256 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 14 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2013
Series Fusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Voltage - Supply 1.425V~1.575V
Base Part Number U1AFS600
Number of I/O 114
RAM Size 4.5kB
Total RAM Bits 36864
Number of Gates 250000
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
90 $105.98400 $9538.56
U1AFS600-FG256 Product Details

U1AFS600-FG256 Overview


This package is included in the 256-LBGA package and is available for purchase. The device has 114 I/O ports for more coherent data transfer. Using a Surface Mount connector, you can mount this FPGA module on the development board. A supply voltage of 1.425V~1.575V is needed in order for fpga chips to operate. The FPGA belongs to the Fusion? series of FPGAs, and it is one type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. Using the Tray layout, this FPGA model can be contained in a very small amount of space. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 36864 bFpga chipss. For related parts, use its base part number U1AFS600. This FPGA module has a RAM si4.5kBe of 4.5kB that is sufficient to make sure that the program is able to run normally. It has a total of 256 pins that are designed for it. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. As a result of the design of this module, the maximum operating temperature reaches 85°C. A higher operating temperature than 0°C is recommended. As a basic building block, fpga semiconductor consists of 250000 gates. The device package supplied by 256-FPBGA (17x17) is one of its suppliers.

U1AFS600-FG256 Features


114 I/Os
Up to 36864 RAM bits
256 LABs/CLBs
85°C gates

U1AFS600-FG256 Applications


There are a lot of Microsemi Corporation U1AFS600-FG256 FPGAs applications.

  • Automotive Applications
  • Scientific Instruments
  • Server Applications
  • Development Boards and Shields for Microcontrollers
  • High Performance Computing
  • Data center hardware accelerators
  • Wireless Communications
  • Digital signal processing
  • OpenCL
  • Industrial Ethernet

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