U1AFS600-FGG256 Overview

In the 256-LBGA package, you will find fpga chips. There are 114 I/Os for better data transfer. Surface Mount-connectors can be used to attach this FPGA module to the development board. Fpga chips operates wFpga chipsh a supply voltage of 1.425V~1.575V. As part of the Fusion? series of FPGAs, it is a type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. As a space-saving measure, this FPGA model is contained within Tray. This device has 36864 RAM bits, which is the number of RAM bits that this device offers. Its base part number U1AFS600 can be used to find parts that are related to it. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. This cable has 256 pins and is designed to connect to a computer. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. This module is capable of operating at a maximum temperature of 85°C. A higher operating temperature than 0°C is recommended. There are 250000 gates in its basic building block. Device package 256-FPBGA (17x17) is provided by its supplier.

U1AFS600-FGG256 Features

114 I/Os
Up to 36864 RAM bits
256 LABs/CLBs
85°C gates

U1AFS600-FGG256 Applications

There are a lot of Microsemi Corporation U1AFS600-FGG256 FPGAs applications.

• Defense Applications
• Random logic
• Bioinformatics
• Medical Electronics
• Development Boards and Shields for Microcontrollers
• Data center search engines
• Software-defined radios
• High Performance Computing
• Military DSP
• Secure Communication