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VSC7108VP-01

VSC7108VP-01

VSC7108VP-01

Microsemi Corporation

Telecom device8 Circuits

SOT-23

VSC7108VP-01 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 36-FBGA
Operating Temperature 0°C~110°C
Packaging Tray
Published 2004
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Power Dissipation 2.65W
Voltage - Supply 2.5V 3.3V
Function Octal Signal Conditioner
Interface TTL/CMOS
Number of Circuits 8
RoHS Status RoHS Compliant
VSC7108VP-01 Product Details

VSC7108VP-01 Overview


In order to save space on the board, the 36-FBGA package is used.Telecommunications equipment is packed in the Tray-way.The mounting type is Surface Mount.The telecom IC is composed of 8 circuits.Providing 2.5V 3.3V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.Telecom switching is possible to achieve reliable performance when the operating temperature is set at 0°C~110°C.Telecom switching is mounted in a Surface Mount-direction.

VSC7108VP-01 Features


Available in the 36-FBGA package

VSC7108VP-01 Applications


There are a lot of Microsemi Corporation VSC7108VP-01 Telecom applications.

  • Digital cross connects (DSX-1)
  • Residential Gateways
  • PBXs channel bank
  • Remote wireless modules
  • Frame Relay Switches and Access Devices (FRADS)
  • Public switching systems
  • E3/DS3 Access Equipment
  • T2 Rates PCM Line Interface
  • T1/E1/J1 LAN/WAN Routers
  • Switching Systems

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