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ZL50017QCG1

ZL50017QCG1

ZL50017QCG1

Microsemi Corporation

256 TerminationsZL50017 Telecom device1 Circuits

SOT-23

ZL50017QCG1 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 52 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LQFP
Operating Temperature -40°C~85°C
Packaging Tray
Published 2007
JESD-609 Code e3
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish MATTE TIN
Subcategory Other Telecom ICs
Voltage - Supply 1.71V~1.89V
Terminal Position QUAD
Terminal Form GULL WING
Supply Voltage 1.8V
Terminal Pitch 0.4mm
Base Part Number ZL50017
JESD-30 Code S-PQFP-G256
Function Switch
Qualification Status Not Qualified
Number of Circuits 1
Operating Supply Current 75mA
Length 28mm
Width 28mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
36 $31.55833 $1136.09988
ZL50017QCG1 Product Details

ZL50017QCG1 Overview


Board space can be saved by using the 256-LQFP package.For telecommunications equipment packing, the Tray method is used.Mounting type Surface Mount is used.An 1-circuit makes up this telecom IC .Telecom circuit is possible to increase efficiency by providing 1.71V~1.89V with a higher voltage.A -40°C~85°C-temperature setting offers reliable performance.Telecom switching is mounted in a Surface Mount-direction.In telecom switching configuration, there are 256 terminations.It operates with a voltage of 1.8V.In addition to telecom switching's base part number ZL50017, it can be used to find other related parts.Designers have a great deal of flexibility with this telecom circuit due to its operation with the supply current provided by 75mA.In the Other Telecom ICs subcategory, telecommunications device belongs.

ZL50017QCG1 Features


Available in the 256-LQFP package
Operating supply current of 75mA

ZL50017QCG1 Applications


There are a lot of Microsemi Corporation ZL50017QCG1 Telecom applications.

  • E1 Multiplexer
  • PDH Multiplexers
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • ISDN Primary Rate Interfaces (PRA)
  • T1/E1/J1 Performance Monitoring
  • Channel Banks
  • Central office
  • Digital Cross-connect Systems (DCS)
  • Fractional T1/E1/J1
  • Interfaces to SONET STS-1 Networks

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