Die is the package in which FIFO memory chip is contained.Tray case is used for packaging.There is a memory of 576 64 x 9 on the FIFO chip that can be used to store applications and data.A temperature regulation of -40°C~85°C is crucial for reliable operation.A 4.5V~5.5V supply voltage is required to power it.It is a component from the 74ACT series.A FIFO's maximum operating supply current of 150mA is available.
74ACT2708 Features
576 64 x 9 memory size 74ACT series
74ACT2708 Applications
There are a lot of MICROSS/On Semiconductor 74ACT2708 FIFOs Memory applications.