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TDA8777HL-33-C1-S

TDA8777HL-33-C1-S

TDA8777HL-33-C1-S

NXP Semiconductors / Freescale

DAC 1.25 B B

SOT-23

TDA8777HL-33-C1-S Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case LQFP
Packaging Bulk
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Interface Parallel
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Number of Bits 10
Resolution 1.25 B
Sampling Rate 330 Msps
Integral Nonlinearity (INL) 1.8 LSB
Number of Converters 3
Conversion Rate 330 Msps
RoHS Status RoHS Compliant
Lead Free Lead Free
TDA8777HL-33-C1-S Product Details

TDA8777HL-33-C1-S Overview


There are two packages that contain it: LQFP package and X package. There is an FPGA model contained in Bulk in order to conserve space. During its maximal operating temperature, this module reaches 70°C. In order to achieve 0°C, the operating temperature must be higher than 0°C. A maximum supply voltage of 3.6V can be applied to this product. The minimal supply voltage required for it is 3V.

TDA8777HL-33-C1-S Features


LQFP package


TDA8777HL-33-C1-S Applications


There are a lot of NXP Semiconductors / Freescale
TDA8777HL-33-C1-S Digital to Analog Converters (DAC) applications.


  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications
  • Process Control and Industrial Automation

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