BAP50-04W,115

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Manufacturer part number:BAP50-04W,115

Manufacturer:NXP USA Inc.

Description:BAP50-04W,115 datasheet pdf and Diodes - RF product details from NXP USA Inc. stock available on our website

Case Package:SOT-23

Datasheet:BAP50-04W,115 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	8 Weeks
Package / Case	SC-70, SOT-323
Surface Mount	YES
Diode Element Material	SILICON
Operating Temperature	-65°C~150°C TJ
Packaging	Tape & Reel (TR)
JESD-609 Code	e3
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	3
Terminal Finish	Tin (Sn)
HTS Code	8541.10.00.70
Subcategory	PIN Diodes
Technology	POSITIVE-INTRINSIC-NEGATIVE
Terminal Position	DUAL
Terminal Form	GULL WING
Peak Reflow Temperature (Cel)	260
[email protected] Reflow Temperature-Max (s)	NOT SPECIFIED
Base Part Number	BAP50-04
Pin Count	3
JESD-30 Code	R-PDSO-G3
Qualification Status	Not Qualified
Number of Elements	2
Configuration	SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Power Dissipation-Max	240mW
Diode Type	PIN - 1 Pair Series Connection
Current - Max	50mA
Capacitance @ Vr, F	0.5pF @ 5V 1MHz
Voltage - Peak Reverse (Max)	50V
Breakdown Voltage-Min	50V
Diode Capacitance-Nom	0.45pF
Resistance @ If, F	5Ohm @ 10mA 100MHz
Diode Capacitance-Max	0.6pF
Minority Carrier Lifetime-Nom	1.05 µs
Diode Res Test Current	0.5mA
Diode Res Test Frequency	100MHz
Diode Forward Resistance-Max	5Ohm
RoHS Status	ROHS3 Compliant