BAP55L,315

new-10%

Manufacturer part number:BAP55L,315

Manufacturer:NXP USA Inc.

Description:BAP55L,315 datasheet pdf and Diodes - RF product details from NXP USA Inc. stock available on our website

Case Package:SOT-23

Datasheet:BAP55L,315 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Package / Case	SOD-882
Surface Mount	YES
Diode Element Material	SILICON
Operating Temperature	-65°C~150°C TJ
Packaging	Tape & Reel (TR)
JESD-609 Code	e3
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	2
ECCN Code	EAR99
Terminal Finish	TIN
HTS Code	8541.10.00.80
Technology	POSITIVE-INTRINSIC-NEGATIVE
Terminal Position	BOTTOM
Terminal Form	NO LEAD
Peak Reflow Temperature (Cel)	260
Time@Peak Reflow Temperature-Max (s)	40
Base Part Number	BAP55
Pin Count	2
JESD-30 Code	R-PBCC-N2
Qualification Status	Not Qualified
Number of Elements	1
Power Dissipation-Max	500mW
Diode Type	PIN - Single
Application	ATTENUATOR; SWITCHING
Current - Max	100mA
Capacitance @ Vr, F	0.28pF @ 20V 1MHz
Voltage - Peak Reverse (Max)	50V
Source Url Status Check Date	2013-10-15 00:00:00
Frequency Band	S B
Resistance @ If, F	700mOhm @ 100mA 100MHz
Diode Capacitance-Max	0.28pF
Minority Carrier Lifetime-Nom	0.28 µs
Diode Forward Resistance-Max	0.7Ohm
RoHS Status	ROHS3 Compliant