BAP64-05,215

new-10%

Manufacturer part number:BAP64-05,215

Manufacturer:NXP USA Inc.

Description:BAP64-05,215 datasheet pdf and Diodes - RF product details from NXP USA Inc. stock available on our website

Case Package:SOT-23

Datasheet:BAP64-05,215 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	13 Weeks
Package / Case	TO-236-3, SC-59, SOT-23-3
Surface Mount	YES
Diode Element Material	SILICON
Operating Temperature	-65°C~150°C TJ
Packaging	Tape & Reel (TR)
Published	1999
JESD-609 Code	e3
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	3
Terminal Finish	Tin (Sn)
Additional Feature	HIGH VOLTAGE
HTS Code	8541.10.00.70
Subcategory	PIN Diodes
Technology	POSITIVE-INTRINSIC-NEGATIVE
Terminal Position	DUAL
Terminal Form	GULL WING
Peak Reflow Temperature (Cel)	260
[email protected] Reflow Temperature-Max (s)	NOT SPECIFIED
Base Part Number	BAP64-05
Pin Count	3
JESD-30 Code	R-PDSO-G3
Qualification Status	Not Qualified
Number of Elements	2
Configuration	COMMON CATHODE, 2 ELEMENTS
Power Dissipation-Max	250mW
Diode Type	PIN - 1 Pair Common Cathode
Application	ATTENUATOR; SWITCHING
Current - Max	100mA
Capacitance @ Vr, F	0.35pF @ 20V 1MHz
Voltage - Peak Reverse (Max)	175V
Breakdown Voltage-Min	175V
Frequency Band	S B
Diode Capacitance-Nom	0.52pF
Resistance @ If, F	1.35Ohm @ 100mA 100MHz
Diode Capacitance-Max	0.35pF
Minority Carrier Lifetime-Nom	1.55 μs
Diode Res Test Current	0.5mA
Diode Res Test Frequency	100MHz
Diode Forward Resistance-Max	40Ohm
RoHS Status	ROHS3 Compliant