BAP70-03,115

new-10%

Manufacturer part number:BAP70-03,115

Manufacturer:NXP USA Inc.

Description:BAP70-03,115 datasheet pdf and Diodes - RF product details from NXP USA Inc. stock available on our website

Case Package:SOT-23

Datasheet:BAP70-03,115 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	13 Weeks
Package / Case	SC-76, SOD-323
Surface Mount	YES
Diode Element Material	SILICON
Operating Temperature	-65°C~150°C TJ
Packaging	Tape & Reel (TR)
Published	2001
JESD-609 Code	e3
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	2
Terminal Finish	Tin (Sn)
Additional Feature	HIGH VOLTAGE
HTS Code	8541.10.00.70
Subcategory	PIN Diodes
Technology	POSITIVE-INTRINSIC-NEGATIVE
Terminal Position	DUAL
Terminal Form	GULL WING
Peak Reflow Temperature (Cel)	260
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Base Part Number	BAP70
Pin Count	2
JESD-30 Code	R-PDSO-G2
Qualification Status	Not Qualified
Number of Elements	1
Power Dissipation-Max	500mW
Diode Type	PIN - Single
Application	ATTENUATOR
Current - Max	100mA
Capacitance @ Vr, F	0.25pF @ 20V 1MHz
Voltage - Peak Reverse (Max)	50V
Breakdown Voltage-Min	50V
Diode Capacitance-Nom	0.57pF
Resistance @ If, F	1.9Ohm @ 100mA 100MHz
Diode Capacitance-Max	0.25pF
Minority Carrier Lifetime-Nom	1.25 µs
Diode Res Test Current	0.5mA
Diode Res Test Frequency	100MHz
RoHS Status	ROHS3 Compliant